Like grinding, polishing is used to remove damaged materials remaining from previous steps. This can be achieved by using finer grinding particles. Polishing can be divided into two different processes

    diamond polishing

    Diamond sand is an abrasive that can achieve maximum material removal rate and optimal flatness. Currently, there is no abrasive that can achieve comparable results. Due to the hardness of diamond, it can easily cut all materials and phases.

    During polishing, smaller chip sizes are expected to achieve a scratch and deformation free sample surface. If using fabric with better elasticity and smaller particles, such as 3 or 1 μ m. The size of the debris is almost zero. Reducing the force applied to the sample also helps to reduce the size of debris generated during polishing.

    Oxide polishing:

    Some materials, especially soft and ductile materials, require the use of oxidation polishing to perform the final polishing to obtain the best quality. The particle size is approximately 0.04 μ m. Silicone with a pH of approximately 9.8 exhibits excellent polishing performance. The perfect combination of chemical activity and fine, mild wear effects can create scratch free and deformation free samples.