PCB (Printed Circuit Board), also known as Printed Circuit Board (PCB) in Chinese, is an important electronic component that supports electronic components and serves as a carrier for the electrical interconnection of electronic components. Due to its use of electronic printing technology, it is called a "printed" circuit board.
There are two types of metallographic polishing cloth and metallographic polishing fluid recommended by QMAXIS in the preparation of PCBs, with SilkCloth polishing cloth (pure silk tightly woven, lint free) used in combination with 3-micron diamond polishing fluid for intermediate polishing; Final polishing, which is the final polishing process, is carried out using ChemoCloth polishing cloth (chemically resistant synthetic fabric, lint free) used in conjunction with a 0.05 micron aluminum oxide polishing solution.
In the process of PCB preparation, due to the variation of grinding direction, the polishing particles will gather together and become large particles, not just the original particle level. Therefore, it is necessary to use the polishing cooling lubricant to ensure that the polishing fluid does not aggregate due to the drying of the grinding environment, and can be effectively separated. All diamond products, as well as oxide polishing fluids, require the addition of lubricants during the sample preparation process, except for 2-in-1 diamond polishing fluids (polishing fluids with lubricants added). Lubricants are used for lubrication and cooling purposes, not only to reduce heat generation, but also to ensure stable and highly reproducible sample preparation due to their low volatility. QMAXIS's polishing cooling lubricants come in three types: water-based, alcohol-based, and oil-based, all of which have low viscosity characteristics. The preparation of PCBs can be done using both water-based and alcohol-based methods.

three μ M Diamond Polishing Fluid AlcoFluid Polishing Cooling Lubricant 0.05 μ M alumina polishing solution
The recommended preparation steps, consumables selection, and preparation parameters for PCBs by QMAXIS are as follows.
PCB metallographic preparation plan
step | Preparation of surfaces | grind size | lubricant | Loading force (single sample) | Time (minutes) | Power head/grinding disc speed (rpm) | Rotation direction |
1 | CarbiPaper Silicon carbide sandpaper | P400 35μm | water | 18N | wear down | 60/200 | Homonymous |
2 | CarbiPaper Silicon carbide sandpaper | P1200 15μm | water | 18N | 0:30 | 60/200 | Homonymous |
3 | SilkCloth polishing cloth | MonoDia Diamond polishing fluid 3μm | DiaFluid or AlcoFluid lubricant | 18N | 3:00 | 60/150 | Homonymous |
4 | ChemoCloth polishing cloth | AluminaPrep Alumina polishing solution 0.05μm | · | 15N | 2:00 | 60/120 | reverse |
· Rinse the sample with water and polish it in the last 15-20 seconds
Do you have any ideas about the PCB preparation plan proposed by Kemai in the United States? Welcome to discuss together!