Among the numerous complex microelectronic materials, silicon was originally defined as a microelectronic material and is also one of the most important and widely used microelectronic materials. Therefore, compared to microelectronic materials, it is not possible to achieve a universal and suitable preparation method for metallographic samples of all microelectronic materials. We usually focus on several very important materials, and QMAXIS sample preparation experts have placed the preparation of metallographic samples of silicon in a relatively important position. They have conducted in-depth research and repeated practice using QMAXIS metallographic equipment and QMAXIS metallographic consumables, A simple and effective preparation method has been summarized.

    We all know that the prominent characteristic of silicon is hardness and brittleness, so the requirements for grinding process become very picky. High hardness and large particle silicon carbide sandpaper grinding can damage the edges and easily cause cracks due to tensile stress. Generally, coarse grinding is not necessary, but fine grinding is used. For silicon wafers that are no longer packaged, on-site metallographic technology is suitable and will not be discussed here; For silicon encapsulated in epoxy resin, we will focus on discussing here. Below is the experience sharing of QMXAIS sample preparation methods among experts.

    Due to the characteristic of silicon materials that cannot be ground with coarse grained silicon carbide sandpaper, the requirements for alignment cutting are more stringent. It is required to use professional precision cutting saw blades of microelectronic materials for precision cutting. When cutting, it is necessary to be as close as possible to the detection target area, but not too close, after all, fine grinding must be carried out, and there must be room for it. Under this premise, let's take a specific look at his preparation method.

    Based on practical preparation experience, a relatively simple and effective three-step sample preparation procedure has been summarized, as follows:

    The above three step method for preparing metallographic samples of epoxy resin encapsulated silicon materials is for your reference. If you need detailed information or have any difficult questions that require the support of QMAXIS application engineers, please feel free to contact us. You are also welcome to personally experience QMAXIS metallographic equipment and QMAXIS metallographic consumables in QMAXIS's laboratory.