QMAXIS (Kemai) cold inlay resin and curing agents, including epoxy resin and acrylic resin.

Advantages of cold embedded resin:


Low viscosity, low shrinkage rate, and good edge preservation effect, suitable for single batch inlay preparation of temperature and pressure sensitive materials.


Why inlay:


Metallographic analysis is generally based on microscopic observation of the cross section. Most of the cut samples are irregular in shape, which is inconvenient to hold the grinding sample. Therefore, most of the cut samples need to be inlaid into the shape of standard size.


What is inlay:


Embedding actually involves burying and wrapping the cut sample in a fixed membrane cavity with liquid resin. After the liquid resin solidifies and demoulds, a standard shaped embedded sample is formed.


According to the operating temperature, there are two options: cold inlay and hot inlay


Cold embedding: In fact, it is the process of using a resin that appears liquid at room temperature, adding a curing agent, and then pouring it into a plastic mold, and then undergoing cross-linking and solidification; Cold setting is often used for some heat sensitive and pressure sensitive samples.


Hot inlay: it is a kind of resin particles that are solid at room temperature, filled into the mold, heated to liquid state, tightly wrapped samples after pressurization, and demoulded after curing. Hot inlay is mostly used for solid materials with heat resistance and pressure resistance.


Cold inlay application range:


From heat sensitive materials such as circuit boards, plastics, or organic matter to pressure sensitive samples such as silk, porous, and coating materials, cold embedding methods are used to prepare samples.


Simple operation for cold inlay:


Adding a curing agent to the liquid resin, pouring it into a mold of silicone or other plastics, and completing the curing and demolding process, cold setting can be completed without equipment or a simple vacuum device.

Cold embedding sample preparation curing time:


Epoxy resin and curing agent, 2h/room temperature, suitable for rapid sample preparation


Epoxy resin and curing agent, 6h/room temperature, suitable for conventional sample preparation


Acrylic resin and curing agent, 8-12 minutes/room temperature, suitable for rapid sample preparation,


Especially suitable for sample preparation of electronic components and PCBs. For porous materials, it is also necessary to assist vacuum negative pressure devices to achieve better penetration effects; Embedding in pressure vessels can also suppress bubbles and further improve sample transparency.