AluminaPrep II, ALUMINA SUSPENSIONS, Agglomerated

AluminaPrep II, Neutral, Agglomerated alumina suspensions offer higher removal rates than other alumina suspensions of the same size. Excellent for lead, magnesium and their alloys.

AluminaPrep III, ALUMINA SUSPENSIONS, De-agglomerated

AluminaPrep III, Neutral, De-agglomerated alumina suspensions offer better surface finish than other alumina suspensions of the same size. Used on most metals and 

minerals.

AluminaDia, ALUMINA SUSPENSIONS, Aluminum Oxide + Polycrystalline Diamond

High efficiency and scratch-dig free surface precision optical material special polishing solution which is a novel blend of water-based alpha alumina and polycrystalline 

diamond. Suitable for fine polishing of materials such as calcium fluoride, zinc sulfide, zinc selenide, sapphire, WC, single crystal Sic, ceramics, hot pressed SiC, etc.

Type

AluminaDia

SilicaPrep, SILICA SUSPENSIONS, Colloidal 

SilicaPrep, Silica oxide suspensions, 9.5pH, Used for chemical/mechanical polishing on metals, minerals, ceramics, glass, sapphires, semi-conductors, microelectronics 

and polymers.

Al-SiPrep, BLEND SUSPENSIONS OF ALUMINA AND COLLIDAL SILICA, Al + Si

Al-SiPrep, Blend of alumina and colloidal silica, 0.05µm, 9pH. The colloidal silica provides a chemical polishing action, whereas, the polycrystalline alumina provides a mechanical polishing action. Especially suitable for final polishing of steel, aluminum alloys, electronic materials.

CeriumPrep, CERIUM OXIDE SUSPENSIONS, Colloidal 

CeriumPrep, For fine polishing of materials such as semiconductors, integrated circuits, optical lenses, fiber optic connectors, glass-ceramic substrates and 

ULTRAPOLISH Series.

PC-0.95-128

PC-0.45-128

PC-0.075-5000

NANOPOLISH Series.

PC2-0.95-128

PC3-0.95-128