Leica EM TXP Leica Precision Grinding Integrated Machine is a unique high difficulty sample surface treatment tool for Leica, which can accurately locate small targets. The target surface preparation system has the function of fixed point block polishing, especially suitable for cutting, polishing, and other series of processing samples detected by SEM, TEM, LM, and AFM. It is also an efficient sample preparation tool that can serve ion beam grinding technology and thin section technology. It can be adapted to various tools, allowing samples to be ground, cut, drilled, ground, and polished without the need for transfer. The entire processing process can be observed and monitored through an integrated stereoscope, saving time and cost. Integrated mirror, sample observation angle adjustable from 0 ° to 60 °, or perpendicular to the front surface of the sample at 90 °, using an eyepiece scale to measure distance. Surface treatment and target detection can be completed without the need to remove the sample. Integrated automatic program control saves users a lot of time and greatly improves work efficiency.